Microstructure and processing effects on stress and reliability for through-silicon vias (TSVs) in 3D integrated circuits

Copper (Cu) Through-silicon via (TSV) is a key enabling element that provides the vertical connection between stacked dies in three-dimensional (3D) integration. The thermal expansion mismatch between Cu and Si induces complex stresses in and around the TSV structures, which can degrade the performance and reliability of 3DICs and are key concerns for technology development. In this dissertation, the effects of Cu microstructure and processing conditions on the stress characteristics and reliability of the TSV structure are studied. First, the stress characteristics of Cu TSV structures are investigated using the substrate curvature method. The substrate curvature measurement was supplemented by microstructure and finite element analyses (FEA) to investigate the mechanisms for the linear and nonlinear stress-temperature behaviors observed for the TSV structure. Implications of the near surface stress on carrier mobility change and device keep-out zone (KOZ) are discussed. Second, via extrusion, an important yield and reliability issue for 3D integration, is analyzed. Synchrotron x-ray microdiffraction technique was introduced for direct measurements of local stress and material behaviors in and around the TSV. Local plasticity near the top of the via was observed which provided direct experimental evidence to support the plasticity mechanism of via extrusion. An analytical model and FEA were used to analyze via extrusion based on local plasticity. Next, the effect of Cu microstructure effect on the thermomechanical behaviors of TSVs is investigated. The contribution from grain boundary and interfacial diffusion on via extrusion and the relaxation mechanisms are discussed. Potential approaches to minimize via extrusion are proposed. Finally, the stress characteristics of 3D die stack structures are studied using synchrotron x-ray microdiffraction. High resolution stress mappings were performed and verified by finite element analysis (FEA). FEA was further developed to estimate the stress effect on device mobility changes and the warpage of the integrated structure.Materials Science and Engineerin

Paper capillary force driven hollow channel as a platform for multiphase flows bioassays

AbstractThis paper develops a simple, inexpensive, and portable diagnostic assays that may be useful in remote settings, and in particular, in less industrialized countries where simple assays are becoming increasingly important for detecting disease and monitoring health. In this assays, the paper capillary force is first used to transport complex fluids such as whole blood or colloidal suspensions that contain particulates in a new type channel - paper capillary driven hollow channel, which offset the disadvantages of current paper microfluidic technologies. To demonstrate the various applications of the paper capillary force driven hollow channel, several devices are design and made to complete the purpose of exhibiting laminar flow in a T-junction microchannel, sheath a core stream in a three-inlet channel and transportation whole blood

3,5-Di-O-benzoyl-1,2-O-isopropyl­idene-α-d-ribo-hexos-3-ulo-1,4:3,6-difuran­ose

The title compound, C23H22O8, is a binary benzoyl ester whose nucleus consists of a fused system made up of a methyl­enedi­oxy ring and two tetra­hydro­furan rings. One of the benzoyl ester groups is attached at the junction of the two tetra­hydro­furan rings. The other is attached to the outer tetra­furan ring. Both the benzoyl ester groups are in an axial conformation with respect to the outer tetrhydro­furan ring. In the crystal, mol­ecules are linked by two weak C—H⋯O hydrogen bonds, forming a chain running parallel to the a axis

ℓ_1-Based Construction of Polycube Maps from Complex Shapes

Polycube maps of triangle meshes have proved useful in a wide range of applications, including texture mapping and hexahedral mesh generation. However, constructing either fully automatically or with limited user control a low-distortion polycube from a detailed surface remains challenging in practice. We propose a variational method for deforming an input triangle mesh into a polycube shape through minimization of the ℓ_1-norm of the mesh normals, regularized via an as-rigid-as-possible volumetric distortion energy. Unlike previous work, our approach makes no assumption on the orientation, or on the presence of features in the input model. User-guided control over the resulting polycube map is also offered to increase design flexibility. We demonstrate the robustness, efficiency, and controllability of our method on a variety of examples, and explore applications in hexahedral remeshing and quadrangulation

Topological dissipative Kerr soliton combs in a valley photonic crystal resonator

Topological phases have become an enabling role in exploiting new applications of nonlinear optics in recent years. Here we theoretically propose a valley photonic crystal resonator emulating topologically protected dissipative Kerr soliton combs. It is shown that topological resonator modes can be observed in the resonator. Moreover, we also simulate the dynamic evolution of the topological resonator with the injection of a continuous-wave pump laser. We find that the topological optical frequency combs evolve from Turing rolls to chaotic states, and eventually into single soliton states. More importantly, such dissipative Kerr soliton combs generated in the resonator are inborn topologically protected, showing robustness against sharp bends and structural disorders. Our design supporting topologically protected dissipative Kerr soliton combs could be implemented experimentally in on-chip nanofabricated photonic devices.Comment: 16 pages, 12 figure

In situ TEM Characterization of Microstructure Evolution and Mechanical Behavior of the 3D-Printed Inconel 718 Exposed to High Temperature

This in situ transmission electron microscopy work presents a nanoscale characterization of the microstructural evolution in 3D-printed Inconel 718 (IN718) while exposed to elevated temperature and an associated change in the mechanical property under tensile loading. Here, we utilized a specially designed specimen shape that enables tensile testing of nano-sized thin films without off-plane deformations. Additionally, it allows a seamless transition from the in situ heating to tensile experiment using the same specimen, which enables a direct correlation of the microstructure and the mechanical property of the sample. The method was successfully used to observe the residual stress relaxation and the formation of incoherent γ′ precipitates when temperature was increased to 700°C. The subsequent in situ tensile test revealed that the exposure of the as-printed IN718 to a high temperature without full heat treatment (solutionizing and double aging) leads to loss of ductility

Chilling Stress—The Key Predisposing Factor for Causing Alternaria alternata Infection and Leading to Cotton (Gossypium hirsutum L.) Leaf Senescence

Leaf senescence plays a vital role in nutrient recycling and overall capacity to assimilate carbon dioxide. Cotton premature leaf senescence, often accompanied with unexpected short-term low temperature, has been occurring with an increasing frequency in many cotton-growing areas and causes serious reduction in yield and quality of cotton. The key factors for causing and promoting cotton premature leaf senescence are still unclear. In this case, the relationship between the pre-chilling stress and Alternaria alternata infection for causing cotton leaf senescence was investigated under precisely controlled laboratory conditions with four to five leaves stage cotton plants. The results showed short-term chilling stress could cause a certain degree of physiological impairment to cotton leaves, which could be recovered to normal levels in 2–4 days when the chilling stresses were removed. When these chilling stress injured leaves were further inoculated with A. alternata, the pronounced appearance and development of leaf spot disease, and eventually the pronounced symptoms of leaf senescence, occurred on these cotton leaves. The onset of cotton leaf senescence at this condition was also reflected in various physiological indexes such as irreversible increase in malondialdehyde (MDA) content and electrolyte leakage, irreversible decrease in soluble protein content and chlorophyll content, and irreversible damage in leaves' photosynthesis ability. The presented results demonstrated that chilling stress acted as the key predisposing factor for causing A. alternata infection and leading to cotton leaf senescence. It could be expected that the understanding of the key factors causing and promoting cotton leaf senescence would be helpful for taking appropriate management steps to prevent cotton premature leaf senescence

Preparation of nitrogen doped zinc oxide nanoparticles and thin films by colloidal route and low temperature nitridation process

International audienceNitrogen doped zinc oxide (ZnO) nanoparticles have been synthesized using a colloidal route and low temperature nitridation process. Based on these results, 200 nm thick transparent ZnO thin films have been prepared by dip-coating on SiO2 substrate from a ZnO colloidal solution. Zinc peroxide (ZnO2) thin film was then obtained after the chemical conversion of a ZnO colloidal thin film by H2O2 solution. Finally, a nitrogen doped ZnO nanocrystalline thin film (ZnO:N) was obtained by ammonolysis at 250°C. All the films have been characterized by scanning electron microscopy, X-ray diffraction, X-Ray photoelectron spectroscopy and UV-Visible transmittance spectroscopy